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EC1019C
InGaP HBT Gain Block
Product Features
DC - 6 GHz +19 dBm P1dB at 2 GHz +31 dBm OIP3 at 2 GHz 17 dB Gain at 2 GHz 3 dB Noise Figure at 2 GHz Available in Lead-free / green SOT-86 Package Style * Internally matched to 50 * * * * * *
Product Description
The EC1019C is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 2000 MHz, the EC1019C typically provides 17 dB of gain, +31 dBm Output IP3, and +19 dBm P1dB. The EC1019C consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in low-cost, surface-mountable plastic lead-free/green/RoHS-compliant SOT-86 packages. A SOT-89 version is also available as the EC1019B. All devices are 100% RF and DC tested. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the EC1019C will work for other various applications within the DC to 6 GHz frequency range such as CATV and mobile wireless.
Functional Diagram
GND
4
RF In
1
RF Out
3
2
GND
Applications
* * * * * Mobile Infrastructure CATV / FTTX W-LAN / ISM RFID WiMAX / WiBro
Function Input Output/Bias Ground
Pin No. 1 3 2, 4
Specifications (1)
Parameter
Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current
Typical Performance (1)
Units
MHz MHz dB dB dB dBm dBm dB V mA
Min
DC 15
Typ
2000 17 19 12 +19 +31 3.0 4.7 70
Max
6000 19
Parameter
Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure
Units
MHz dB dB dB dBm dBm dB 500 20.5 -26.9 -24.4 +19 +34 2.9
Typical
900 19.7 -25.5 -17.2 +19 +34 2.9 1900 17.2 -19.9 -11.3 +19.5 +31 3.0 2140 16.7 -15.4 -12.2 +19 +31 3.0
14.5
4.2
5.2
1. Test conditions unless otherwise noted: 25 C, Supply Voltage = +6V, Rbias = 16.5, 50 system. 2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Operating Case Temperature Storage Temperature Device Current RF Input Power (continuous) Junction Temperature
Rating
-40 to +85 C -55 to +150 C 130 mA +12 dBm +250 C
Ordering Information
Part No.
EC1019C-G EC1019C-PCB
Description
InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-86 package)
700 - 2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage.
WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com
Page 1 of 4 April 2007
EC1019C
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +6 V, Rbias = 15 , Icc = 70 mA
Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure MHz dB dB dB dBm dBm dB 100 21.0 -32.0 -23 +19.4 +33 3.3 500 20.5 -26.9 -24.4 +19.4 +33.2 2.9 900 19.7 -25.5 -17.2 +19.4 +33.6 2.9 1900 17.2 -19.9 -11.3 +19.5 +31 3.0 2140 16.7 -15.4 -12.2 +19.0 +31 3.0 2400 16.2 -12.7 -13.8 +18.8 +30.7 3.1 3500 13.8 -12.0 -12.2 +16.2 5800 10.7 -9.9 -11.3
1. Test conditions: T = 25 C, Supply Voltage = +6 V, Device Voltage = 4.7 V, Rbias = 16.5 , Icc = 70 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
S 1v . F q e c 2 s re u n y
S11, S22 vs. Frequency
Icc vs. Vde
160 120
2 5 S11,S22 (dB) 2 0 S21 (dB) 1 5 1 0 5 0 0 1 2 3 F q e c (G z) re u n y H
OIP3 vs. Frequency 40 35
0 -5
-15 -20
S11
Icc (mA)
-10
S22
80 40 25C 0 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0
+ 5C 2
4 5 6
-25 -30 0 1 2 3 4 5 6 Frequency (GHz)
Noise Figure vs. Frequency
Vde (V) P1dB vs. Frequency 24
5 4 3 2 1
25C 1000 1500 85C 2000 -40C 2500 3000
OIP3 (dBm)
30 25 20 500
NF
P1dB (dBm)
NF (dB)
20
16 25C 85C -40C 2500 3000
0 0 500 1000 1500 2000 2500 Frequency (MHz)
12 500
1000
Frequency (MHz)
1500 2000 Frequency (MHz)
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 2 of 4 April 2007
EC1019C
InGaP HBT Gain Block
Recommended Application Circuit
Vcc Icc = 70 mA
R4 Bias Resistor C4 Bypass Capacitor C3 0.018 F L1 RF Choke RF IN EC1019C C1 Blocking Capacitor C2 Blocking Capacitor RF OUT
Reference Designator L1 C1, C2, C4
50 820 nH .018 F
Recommended Component Values Frequency (MHz) 500 900 1900 2200 220 nH 68 nH 27 nH 22 nH 1000 pF 100 pF 68 pF 68 pF
Recommended Bias Resistor Values 2500 18 nH 56 pF 3500 15 nH 39 pF Supply Voltage 6V 7V 8V 9V 10 V 12 V R1 value 16.4 ohms 30.7 ohms 45 ohms 59 ohms 74 ohms 102 ohms Size 0805 1210 1210 2010 2010 2512
1. The proper values for the components are dependent upon the intended frequency of operation. 2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig. L1 C1, C2 C3 C4 R4
Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 F chip capacitor Do Not Place 15 1% tolerance
Size 0603 0603 0603 0805
The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +6 V. A 1% tolerance resistor is recommended.
Typical Device S-Parameters
S-Parameters (Vdevice = +4.7, ICC = 70 mA, T = 25C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000
-24.85 -27.17 -23.41 -19.49 -16.60 -11.88 -12.89 -11.92 -8.69 -8.09 -10.55 -11.17 -9.71
-7.98 -60.24 -46.18 -28.53 -74.75 -105.49 -134.51 -151.23 -134.38 -135.74 -168.37 156.03 159.92
20.43 20.09 19.25 18.19 17.15 16.21 15.41 14.26 13.03 12.56 12.38 11.61 10.74
176.75 153.21 129.05 107.82 89.07 71.51 55.02 39.14 27.44 15.99 -0.44 -16.12 -27.95
-22.76 -22.63 -22.38 -22.09 -21.57 -20.87 -20.02 -19.68 -19.34 -18.43 -17.23 -16.81 -16.53
0.42 1.05 1.04 0.58 0.00 -2.16 -6.13 -10.34 -12.21 -14.58 -23.37 -32.14 -37.03
-19.95 -24.50 -18.46 -12.87 -12.94 -15.63 -21.87 -13.98 -10.61 -11.00 -18.32 -13.00 -9.89
-3.26 -34.64 -90.44 -100.14 -95.63 -78.47 -147.92 -165.49 -125.29 -108.79 -156.08 142.07 159.16
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 3 of 4 April 2007
EC1019C
InGaP HBT Gain Block
EC1019C-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the pins is annealed matte tin over copper. It is compatible with both lead-free (maximum 260C reflow temperature) and leaded (maximum 245C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with a two-digit numeric lot code (shown as "XX") followed by a "B" designator on the top surface of the package. The obsolete tin-lead package is marked with a two-digit numeric lot code followed with an "A" designator; it may also have been marked with an "A" designator followed by a two-digit lot code. Tape and reel specifications for this part are located on the website in the "Application Notes" section.
MSL / ESD Rating
ESD Rating: Value: Test: Standard:
Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114
Land Pattern
MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature Thermal Resistance, Rth
Rating
-40 to +85 C 179 C/W
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 4 of 4 April 2007

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